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Description
Essmetuin Solder Paste Content: Alloy Tin 62.8% Pb 36.8%Ag0.4%, Solder Flux Content: 10.8% Lead-Containing Solder Paste - Medium Temperature Solder Paste With Flux, Melting Point: 183 ℃ (361F) Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance
